Advances in Embedded and Fan-Out Wafer Level Packaging Technologies

Advances in Embedded and Fan-Out Wafer Level Packaging Technologies

5/5

Examines the advantages of Embedded and FO-WLP technologies, potential application spaces, package structures available in the industry, process flows, and material challengesEmbedded and fan-out wafer level packaging (FO-WLP) technolog.

First published
2019
Publishers
Wiley & Sons· Incorporated· John
Language
English

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